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this is information on a product in full production. october 2012 doc id 023846 rev 1 1/12 12 ESDALCL5-1BM2 single-line low capacitance and low leakage current esd protection datasheet ? production data features single-line low capacitance transil diode bidirectional esd protection breakdown voltage v br = 5.0 v min. low diode capacitance (26 pf typ at 0 v) low leakage current: ? 10 na at 3 v ? 1 na at 1 v very small pcb area: 0.6 mm2 ecopack ? 2 compliant components complies with the following standards: iec 61000-4-2 level 4 and higher ? 30 kv (air discharge) ? 30 kv (contact discharge) mil std 883g - method 3015-7: class 3 ? human body model applications where transient overvoltage protection in esd sensitive equipment is required, such as: portable multimedia players and accessories portable healthcare equipment notebooks communication systems cellular phone handsets and accessories figure 1. functional diagram description the ESDALCL5-1BM2 is a bidirectional single- line tvs diode designed to protect data lines or other i/o ports against esd transients. this device is ideal for applications where reduced line capacitance and board space saving are required. its low leakage current makes it suitable for portable equipment. sod882 esdalc5-1bm2 i/o1 i/o2 www.st.com
characteristics ESDALCL5-1BM2 2/12 doc id 023846 rev 1 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 30 kv p pp (1) 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. peak pulse power dissipation (8/20 s) t j initial = t amb 150 w i pp peak pulse current (8/20 s) 9 a t j junction temperature -55 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics (values, t amb = 25 c) symbol test condition min. typ. max. unit v br from pin1 to pin2, i r = 1 ma 11 13 v from pin2 to pin1, i r = 1 ma 5 8 i rm v rm = 3 v 10 na v rm = 1 v 1 r d square pulse, i pp = 1 a, t p = 2.5 s 650 m c line f = 1 mhz, v r = 0 v 26 30 pf symbol parameter v = breakdown voltage i = leakage current at v v = stand-off voltage i = peak pulse current i = breakdown current br rm rm rm pp r v = clamping voltage c = input capacitance per line cl line i v v br v rm i r i rm i rm i r v rm v br
ESDALCL5-1BM2 characteristics doc id 023846 rev 1 3/12 figure 3. relative variation of peak pulse power versus initial junction temperature figure 4. leakage current versus junction temperature (typical values, v r =1v) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 p [t initial]/p [t initial = 25c] pp j pp j t (c) j 1 10 100 1000 0 20 40 60 80 100 120 140 t (c) j i (pa) r figure 5. leakage current versus reverse applied voltage (typical values) figure 6. peak pulse power versus exponential pulse duration (direct) 60 -20 -60 -100 100 20 -14-12-10-8-6-4-20246810 v (v) r i r (a) 1 10 100 1000 10000 1 10 100 1000 p (w) pp t (s) p figure 7. peak pulse power versus exponential pulse duration (reverse) figure 8. clamping voltage versus peak pulse current (typical values, exponential waveform, direct) 1 10 100 1000 10000 1 10 100 1000 t (s) p p (w) pp 0.1 1.0 10.0 100.0 8 10121416182022 i (a) pp v (v) cl
characteristics ESDALCL5-1BM2 4/12 doc id 023846 rev 1 figure 9. clamping voltage versus peak pulse current (typical values, exponential waveform, reverse) figure 10. junction capacitance versus reverse applied voltage (typical values, direct) 0.1 1.0 10.0 100.0 6 8 10 12 14 16 i ( a ) pp v (v) cl 0 10 20 30 40 50 01234 5 c(pf) v (v) line figure 11. junction capacitance versus reverse applied voltage (typical values, reverse) figure 12. esd response to iec 61000-4-2 (+30 kv contact discharge) 0 10 20 30 40 50 012345 c(pf) v (v) line 20 v/div 97 v 21 v 25 v 1 2 3 16 v 4 20 ns/div v : esd peak voltage v :clamping voltage at 30 ns v :clamping voltage at 60 ns pp cl cl v :clamping voltage at 100 ns cl 1 2 3 4 figure 13. esd response to iec 61000-4-2 (-30 kv contact discharge) figure 14. s21 attenuation measurement result 20 v/div -18 v -11 v 4 3 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4 -86 v 1 -13 v 2 100k 1m 10m 100m 1g - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 0 db f(hz)
ESDALCL5-1BM2 ordering information scheme doc id 023846 rev 1 5/12 2 ordering information scheme figure 15. ordering information scheme esda lc l 5 - 1 b m2 esd array low capacitance package low leakage breakdown voltage number of lines directional 5 = 5 volts minimum 1 = 1 line protected b = bi-directional m2 = sod882
package information ESDALCL5-1BM2 6/12 doc id 023846 rev 1 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 16. sod882 dimension definitions table 3. sod882 dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.40 0.47 0.50 0.016 0.019 0.020 a1 0.00 0.05 0.000 0.002 b1 0.45 0.50 0.55 0.018 0.020 0.022 b2 0.45 0.50 0.55 0.018 0.020 0.022 d 0.55 0.60 0.65 0.022 0.024 0.026 e 0.95 1.00 1.05 0.037 0.039 0.041 e 0.60 0.65 0.70 0.024 0.026 0.028 l1 0.20 0.25 0.30 0.008 0.010 0.012 l2 0.20 0.25 0.30 0.008 0.010 0.012 pin # 1 id e d a1 a l1 e l2 b2 b1
ESDALCL5-1BM2 package information doc id 023846 rev 1 7/12 note: product marking may be rotated by multiples of 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 19. sod882 tape and reel specifications figure 17. sod882 footprint in mm (inches) figure 18. sod882 marking 0.55 (0.022) 0.40 (0.016) 0.50 0.020 0.55 (0.022) s pin1 pin 2 user direction of unreeling all dimensions in mm 4.0 2.0 8.0 2.0 1.75 3.5 ? 1.50 0.70 0.20 1.15 s s s s s s s 0.59 cathode bar
recommendations on pcb assembly ESDALCL5-1BM2 8/12 doc id 023846 rev 1 4 recommendations on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 20. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 21. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = lead footprint on pcb stencil window position lead footprint on pcb package footprint 0.45 mm 0.39 mm 0.05 mm 0.05 mm stencil window position
ESDALCL5-1BM2 recommendations on pcb assembly doc id 023846 rev 1 9/12 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendations on pcb assembly ESDALCL5-1BM2 10/12 doc id 023846 rev 1 4.5 reflow profile figure 22. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ESDALCL5-1BM2 ordering information doc id 023846 rev 1 11/12 5 ordering information 6 revision history table 4. ordering information order code marking (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location package weight base qty delivery mode ESDALCL5-1BM2 s sod882 0.92 mg 12,000 tape and reel table 5. document revision history date revision changes 31-oct-2012 1 initial release.
ESDALCL5-1BM2 12/12 doc id 023846 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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